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麻豆传媒映画

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Copper Foil / Copper Alloy

Copper Foil / Copper Alloy

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Sputtering Targets

Sputtering Targets

What Is Sputtering?
Sputtering Targets for Semiconductors
AlSc Sputtering Target
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Compound Semiconductors and Crystal Materials

Compound Semiconductors and Crystal Materials

InP Substrates
CdZnTe (CdTe) Substrates
Strontium Titanate (SrTiO₃)
Rutile Titanium Dioxide (TiO₂)
YAG Ceramics for Laser Applications

Metal and Compound Powders

Metal and Compound Powders

Tantalum and Niobium Materials
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Special Ceramic Powders

Negative Thermal Expansion Material ZrW₂O₈

High Purity Metals

High Purity Metals

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Surface Treatment Agents

Upinorg (high-purity copper sulfate)

Electroless UBM Plating Service

Stainless steel

Shielding Materials

Shielding Materials

3D formable Sheets for Electromagnetic Shielding（Mighty Shield^®）
Sn-Cu-PET foil for electromagnetic shielding

Nonferrous Metals and Chemical Products

Nonferrous Metals and Chemical Products

Refined Copper/Copper Cakes and Billets
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Sulfuric acid, slag, gypsum, etc.

Products Under Development

Products Under Development

Special Ceramic Powders
3D formable Sheets for Electromagnetic Shielding（Mighty Shield^®）
Metal Powders for Additive Manufacturing
High Purity Chlorides
Lead-free Piezoelectric Powder Material
AlSc Sputtering Target
YAG Ceramics for Laser Applications

Semiconductors and Sensors

Semiconductors and Sensors

For Front-end (Wafer) Processes

Sputtering Targets for Semiconductors
AlSc Sputtering Target
Sputtering Targets for Magnetic Devices
Sputtering Targets for Transparent Conductive Films
Sputtering Targets for Optical Films
High Purity Chlorides
Lead-free Piezoelectric Powder Material
Tantalum and Niobium Materials

For Back-end (Assembly) Processes

Copper Alloys for Lead Frames
Surface Treatment Agents
Upinorg (high-purity copper sulfate)
Electroless UBM Plating Service
Low α Tin
Rolled Copper Foil for Graphene

Compound Semiconductor Substrates

InP Substrates
CdZnTe (CdTe) Substrates

Circuit Boards

Treated Rolled Copper Foil
Electro-deposited Copper Foil
Surface Treatment Agents
Upinorg (high-purity copper sulfate)
Tantalum and Niobium Materials
Negative Thermal Expansion Material ZrW₂O₈
Low α Tin
High Strength Copper Alloys for Sockets

Assembly

Negative Thermal Expansion Material ZrW₂O₈
High Purity Metals
Tantalum and Niobium Materials
Low α Tin
Electroless UBM Plating Service

Displays

Sputtering Targets for Transparent Conductive Films
Sputtering Targets for Optical Films
Rolled Copper Foil for Graphene

Batteries and Energy

Batteries and Energy

Rolled Copper Foil HS1200 / HS1200-V2
InP Substrates
CdZnTe (CdTe) Substrates
Strontium Titanate (SrTiO₃)
Rutile Titanium Dioxide (TiO₂)
Tantalum and Niobium Materials
High Purity Chlorides
Rolled Copper Foil for Graphene

Additive Manufacturing

Additive Manufacturing

Metal Powders for Additive Manufacturing

Connectors

Copper Alloys for Board to Board Connectors
Copper Alloys for FPC Connectors
Copper Alloys for Backplane Connectors
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Copper Alloys for SIM Card Connectors
Copper Alloys for USB Connectors
Surface Treatment Agents

Magnetic Devices

Magnetic Devices

Sputtering Targets for Magnetic Devices

Electromagnetic Shielding

Electromagnetic Shielding

Sn-Cu-PET foil for electromagnetic shielding
3D formable Sheets for Electromagnetic Shielding（Mighty Shield^®）

Communications

Surface Treatment
AlSc Sputtering Target
InP Substrates
Strontium Titanate (SrTiO₃)
Rutile Titanium Dioxide (TiO₂)
Tantalum and Niobium Materials

Optics

Sputtering Targets for Transparent Conductive Films
Sputtering Targets for Optical Films
InP Substrates
CdZnTe (CdTe) Substrates
Strontium Titanate (SrTiO₃)
Rutile Titanium Dioxide (TiO₂)
YAG Ceramics for Laser Applications
Tantalum and Niobium Materials
High Purity Chlorides

Camera Modules

Copper Titanium Alloy
Sputtering Targets for Optical Films
High Purity Chlorides

Piezoelectricity

Piezoelectricity

AlSc Sputtering Target
Lead-free Piezoelectric Powder Material

Thermal Control

Thermal Control

Copper Alloys for Cooling Modules
Negative Thermal Expansion Material ZrW₂O₈
MoSi₂ Heater
Rolled Copper Foil for Graphene

Corporate Overview

Message from the Management
Policy
Quick Guide to 麻豆传媒映画 Metals
Business Segments
Corporate Data
Organization and Executive Officers
Corporate History
Operating Sites and Group Companies
Long-Term Vision and Medium- to Long-term Business Strategies and Business Targets
Purchasing Information

Products and Services

Search by Category
Search by Keyword

Research and Development

Our Core Technologies Contributing to Societal Growth and Innovation
Initiatives for Co-creation
Collaboration in the Group
SQUARE LAB

Message From the President
Our Sustainability-Focused Management
Our Material Issues and Initiatives
Sustainability Report
Fiscal 2025 Outside Directors Roundtable Discussion
ESG Data
GRI Standards Content Index
About This Site

麻豆传媒映画

麻豆传媒映画 Release
Trade Fairs and Exhibitions

Corporate Overview
Products and Services
Research and Development
Investors
Sustainability
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